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Produits ou Machines
Supplier of Cutting technology for technical glass, Grinding techniques for flat glass, Grinding techniques for straight edges, Grinding techniques for patterned glass, Matting / Supercalendering / etching / sand blasting technologies, Glassfrosting, Polishing technology, Mirror coating products, Bonding technology
We are a leading supplier of customized products that are manufactured by our advanced high-precision processes and composite technology. Our main products are glass parts for the MEMS industry and metal-heatsinks for opt-telecom and high power lasers.
After great efforts, we have succeeded in developing unique drilling processing to produce through holes and patterned micro-grooves. In particular, our structured glass wafers by drilling, sandblasting and Ultrasonic machining have become integrated into pressure, accelerometer and gyro sensor in the fields of automobile, measuring equipment and medical instruments.
We handle Pyrex, Eagle2000, Borofloat, SD2, SD3, SWYY, Quartz and Si. The features and benefits of our processing are Aspect ratio 3:1, Microthrough-hole φ0.15mm and Accurate positioning and tolerance.
We provide a variety of products from glass wafers for MEMS devices used in projectors or pressure/acceleration sensors to microfluidic glass products for the biotechnology/medial industries based on the customers’ need. In addition, we have started providing processing of chemically-strengthened glasses for the touch panel industry. Glass products
Through glass via (TGV)
Most suitable for miniaturizing semiconductor devices. The metal via can improve the high-frequency properties of the devices
Leads to the miniaturization of devices in combination with semiconductors/electronic parts
Cavity glass / Cap glass
Hi-precision cavity can be formed inside of the glass wafer. Transparent and thinner finish is available on the cavity bottom
Can be used as general-purpose via wafers with the holes plated to form electrodes. Also suitable for cell-culture systems.
Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices.
Microfluidic glass products with excellent thermal and chemical resistance. The microfluidic channels can be flexibly designed in 3 dimensions.